~ Discover advanced semiconductor packaging for high-temperature, high-power, and high-reliability applications
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging Conference, which takes place April 14–17 in Albuquerque, NM, and at the Components for Military & Space Electronics (CMSE) event, which runs from April 29–May 1 in Los Angeles, CA at Booth B20.
StratEdge’s molded ceramic packages offer unparalleled reliability, designed to handle high-frequency chips up to 18 GHz, with over 200 standard outlines available, providing a vast array of packaging options. Many open-tooled designs are available with 50 ohm impedance high-frequency transitions, which provide convenience and ease for packaging high-performance semiconductors.
StratEdge’s packages are built for maximum reliability in power and RF applications under extreme conditions. Its molded ceramic packaging solutions offer robust thermal dissipation and high-frequency performance. According to Casey Krawiec, VP of Global Sales at StratEdge, “Our molded ceramic packages are extremely popular where devices encounter harsh environments. Testing has shown they can withstand extended exposures at over 500°C, which is why they’re selected for automotive, down-hole, jet engine, and other high-temperature applications, as well as traditional uses in space and defense.”
For more information or to arrange a meeting, contact StratEdge at info@stratedge.com or visit the website at www.stratedge.com.
Photo www.stratedge.com/high-temperature-packages.gif
Virtual Tour https://youtu.be/ewJuORN5vyQ
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