Digital Manufacturing

ShunYun Technology and NewPhotonics Announce Volume PIC Mfg Partnership

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.

Ethernet pluggable optics are forecasted to scale to >100 million by 2028 to meet data center scale out requirements, creating an urgent demand for volume PIC manufacturing. As a global provider of volume transceiver manufacturing today, the SYT supply chain, excellent quality standards, and customer and ecosystem technology provide the strong, single-point manufacturing hub ideal for volume PIC production.

SYT expertise in post silicon manufacturing back-end steps including bumping, stealth dicing, back grinding, and testing are vital elements in its new role as the best-in-class scale OSAT partner to NewPhotonics. SYT will provide full functional wafer- and PIC-level test, and laser burn-in at both volume and NPI.

“This collaboration with NewPhotonics reflects our strong leadership, focus and commitment to mass producing integrated silicon photonics solutions in response to the high demand for optical interconnect innovation by hyperscalers and AI factories worldwide.” said SYT Sales VP TF Tseng. “We have a clear plan and process to ramp production of the innovative NPG PIC chip at the scale, reliability and performance the market expects.”. 

NewPhotonics is preparing for high volume manufacturing of the NPG PIC transmitter on chips for 1.6T DSP-based transceivers and the 800G and1.6T LPO+™ optical signal processing chip.

“This partnership is the critical ingredient to delivering innovative photonic IC solutions that achieve the scale demand for optical interconnect solutions,” said Doron Tal, SVP and General Manager, Optical Connectivity at NewPhotonics. “We share a long-term vision and strategy for highly integrated PIC production that simplifies scalable manufacturing with improved module reliability.

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