At CommunicAsia 2025 in Singapore, May 27–29, NEXCOM, a leading global supplier of network appliances, will showcase its latest portfolio of compact, rugged, and AI-powered network solutions designed to meet the growing demands of OT security, edge AI, and dual 5G failover connectivity. Visit NEXCOM at Hall 3, booth 3F3-13 to discover secure edge networking innovations purpose-built for the future.
A spotlight of the exhibit is NEXCOM’s dual 5G failover solutions, available in two form factors:
- DNA 140 – a desktop AI-enhanced platform for intelligent analytics and resilient 5G connectivity in branches.
- ISA 141 – a rugged DIN rail box built for wide-temperature industrial environments, ensuring continuous uptime.
Both offer hybrid multi-carrier connectivity, seamlessly switching between public and private 5G for fail-safe communications in critical infrastructure.
NEXCOM will also showcase its complete OT security lineup, with each product mission-built for specific roles in ICS protection. For data-heavy edge sites, NEXCOM delivers compact AI-ready rackmounts, ideal for SD-WAN, SASE, and next-gen firewall applications. Completing the lineup is a suite of 5G uCPEs, headed by DFA 1163 supporting mmWave (FR2) for ultra-fast, low-latency wireless connectivity.
From enabling ultra-low-latency to safeguarding OT environments and accelerating edge AI, NEXCOM’s solutions are built to integrate seamlessly with third-party software, accelerating deployment and reducing total cost of ownership.
Why visit NEXCOM at CommunicAsia 2025?
- Learn how to scale your infrastructure with performance, efficiency, and security
- Get hands-on with dual 5G failover devices for hybrid connectivity
- Explore a complete OT security lineup across mission-oriented rugged DIN rails
- Meet NEXCOM experts to discuss integration opportunities and tailored deployments
Experience the future of agile, edge-ready networking built for real-world deployments with NEXCOM at Hall 3, booth 3F3-13.
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