Laser Photonics Corporation (LPC) (NASDAQ: LASE), a leading global industrial developer of laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS), announced the expansion of their Laser Marking and Stripping technologies development project.
Laser processing has emerged as an effective method of wire stripping and marking due to its non-contact nature, precision and versatility. The technology prevents any damage to conductors and insulation during stripping and marking, keeping the shield intact and eliminating weak spots for breakage or conductor resistance. It accomplishes this while lowering the need for frequent cleaning and maintenance that traditional methods require.
Laser wire stripping and marking systems by CMS offer high-speed capabilities for various wire colors and sizes, including basic wires, coaxial cables, wire conduit shielding, and electrical wires. The technology is compliant with aerospace SAE standards while also serving as a great solution for marking medical-grade cables and wires due to its precision and versatility.
“By combining the expertise of Control Micro Systems and Laser Photonics, we aim to enhance wire stripping and marking systems to meet the growing demand we have seen, starting with the aerospace and defense industries,” said John Armstrong, Executive Vice President of LPC.
Professionals continue to adopt laser wire stripping and marking technology for its numerous benefits. The systems developed by CMS are ideal for small, sensitive surfaces and can be standalone or integrated into high-speed line operations.
Control Micro System’s Class I wire stripping and marking systems feature Through the Optics Vision (TTOV) for precise processing and data verification and include CMS Process Engine software with a user-friendly interface and optional production line communication. Easy setup and quick changeovers ensure high throughput with excellent accuracy and repeatability, delivering high yield and customer value.
Leveraging Control Micro System’s specialized expertise, LPC is channeling resources into R&D in the Laser Wire Stripping and Marking manufacturing area, aligning with its comprehensive diversification strategy. This move aims to enhance shareholder value and build resilience in evolving markets. For more information about the wire stripping and marking product line or LPC’s lines of cleaning, cutting, welding, marking, or engraving laser systems, visit https://www.laserphotonics.com.
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