Next-Gen Manufacturing

Infinitesima Metron3D Adopted for In-line DRAM Process ControlRS PRO

Infinitesima Metron3D Adopted for In-line DRAM Process ControlRS PRO
  • Ultra-fast, in-line atomic force microscope (AFM), the Metron®3D, goes online for advanced DRAM manufacturing at SK hynix in Korea
  • The Metron®3D is able to generate images at speeds 10× that of a typical AFM, suitable for the rapid pace of high-volume manufacturing (HVM)

Infinitesima today announced that SK hynix, a full stack artificial intelligence (AI) memory provider, has adopted the Metron®3D 300mm in-line wafer metrology system and released it for use in volume production. The Metron3D provides three-dimensional (3D) process control with sub-nanometre accuracy, crucial for fabrication of SK hynix’s next-generation memory devices.

The release to production follows an extensive evaluation period, applying the system for characterization across multiple process steps.

Mr. Young-Hyun Choi, Head of DMI (Defect Analysis, Metrology and Inspection Technology), stated, “Three-dimensional process control at the nano-scale level is becoming increasingly important to ensure high yield in advanced DRAM processes. Infinitesima’s Metron®3D has demonstrated excellent sub-nanometre 3D metrology with the required cost-of-ownership necessary for HVM implementation.”

The Metron®3D features Infinitesima’s proprietary Rapid Probe Microscope™ (RPM™) technology that provides AFM measurement capability at 10× to 100× typical AFM throughput. The system’s capabilities also include fully automated wafer, data, and probe handling, making it optimal for in-line volume production of semiconductor devices. The investment in this metrology solution highlights SK hynix’s commitment to maintaining technical leadership in the development and manufacture of computer memory.

“We are delighted to be working with SK hynix; their support and guidance has enabled rapid qualification of our Metron®3D system and deployment in HVM,” stated Peter Jenkins, Infinitesima President & CEO.

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