68% market share in 2024; Cements Ceva’s dominance in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP and integral role of connectivity for smart edge devices as demand grows
Reinforcing the company’s pivotal role in enabling the intelligent, connected world, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced it has once again been named the #1 vendor in Wireless Connectivity IP by IPnest in its latest 2025 Design IP Report. Ceva grew its wireless connectivity IP market share to 68% in 2024 – more than 10 times larger than its closest peer. This commanding lead reflects Ceva’s continued dominance in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP solutions, which are foundational to the next generation of smart edge devices.
The growing convergence of wireless connectivity, on-device AI, and sensor fusion is driving a new wave of smart edge devices, particularly in consumer and industrial SoCs and MCUs. As these devices increasingly require real-time decision-making, local data processing has become essential for reducing latency, preserving privacy, and improving energy efficiency. Ceva’s integrated IP portfolio supports this shift by allowing seamless implementation of connectivity, AI NPUs, and sensor technologies – helping customers deliver smarter, more responsive, and secure products.
“Wireless connectivity is foundational to the smart edge, and our continued leadership in this space reflects the trust our customers place in Ceva to deliver high-performance, low-power IP solutions,” said Michael Boukaya, Chief Operating Officer at Ceva. “The latest IPnest report reinforces our strategy to build on this leadership by offering a unified IP portfolio that integrates wireless, sensing, and AI capabilities—enabling our customers to accelerate innovation across the evolving AIoT landscape.”
“Ceva remains the benchmark in Wireless Interface IP,” said Dr. Eric Esteve, Principal Analyst at IPnest. “Their broad portfolio and consistent innovation make them the go-to partner for integrating multi-standard wireless into SoCs.”
The Ceva-Waves™ family offers the industry’s most comprehensive wireless connectivity IP portfolio, spanning Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Optimized for seamless SoC and MCU integration, these IPs support both single and multi-standard configurations through the Ceva-Waves-Links platform. The portfolio also includes the Ceva-Waves Dragonfly platform, a fully integrated solution for LTE-M and NB-IoT connectivity with optional GNSS and eSIM support—ideal for low-power, wide-area applications such as asset tracking, smart metering, and industrial monitoring. Ceva recently expanded its Ceva-Waves platform to include RF IP, introducing its first Bluetooth 7 RF IP on TSMC 12nm, alongside support for IEEE 802.15.4—furthering its commitment to delivering complete, silicon-proven wireless solutions from baseband to RF. For more information, visit https://www.ceva-ip.com/product/ceva-waves-links/.
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