Boyd Expands High Volume Automated Manufacturing Capacity for Liquid Cooled Solutions in Next-Gen Data Centers
Boyd is excited to announce an increase in AI data center liquid cooling system production capacity with the expansion of its design and manufacturing facility in Bac Ninh, Vietnam in response to growing customer demand. The expansion will bring the Boyd Vietnam campus to approximately 800,000 square feet, up from its current footprint of 400,000 square feet.
Boyd Vietnam features lean, automated manufacturing and assembly processes for high volume production of direct-to-chip liquid cooling loops, in rack manifolds, thermal control units (TCUs), and coolant distribution units (CDUs). The expansion creates capacity to scale liquid cooled solutions, solving customers’ increasing compute, power, and thermal density demands in rapidly expanding AI data centers.
“We work diligently to anticipate customer and market needs, continually aligning our company, its supporting footprint, and technology innovation to capture demand,” said David Huang, Boyd President, Thermal Solutions Division. “With many customers requiring unique global manufacturing needs, Boyd’s Vietnam capacity and capabilities provide additional flexibility to meet these customer requirements.”
The Vietnam facility includes on-site design, testing, process, prototyping, and manufacturing engineering teams to enable highly responsive full product lifecycle and program support, ensuring Boyd can best support customers’ growth plans and accelerated speed to market for high-volume, high-performance AI data center cooling.
